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STATSChipPAC balanced diplexer
This balanced diplexer example is from STATSChipPAC. STATSChipPAC employs a copper metallization process capable of depositing 8 microns of copper on a silicon wafer. This results in higher Q components that reduce loss in the RF signal transmission path, thereby increasing battery performance of the wireless system and improving reception. The size of matching circuitry and filters is often reduced by 40%. The pictures below show the correlation between measured data and EMX simulation results.
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Related information STATSChipPAC databook with all components designed using EMX
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